Beyond the PDK. Bespoke Physics. 

Standard Process Design Kits (PDKs) cover 90% of applications, but innovation often lives in the other 10%. When your physics demands more than a standard library, the TFLX™ technology platform offers the flexibility to go beyond. 

TFLX™ technology is more than just a manufacturing step; it is a comprehensive material and process ecosystem. By combining our proprietary manufacturing methods like Diamond-Like Carbon (DLC) etching with advanced stack engineering, we can adapt the entire photonic environment to your specific requirements—unlocking device architectures that standard foundries simply cannot support. 

Custom Capabilities 

We open the full TFLX™ process window to help you realize unique device architectures. 

1. Broad Wavelength Optimization While our standard PDKs are optimized for O and C bands, the TFLX™ platform is inherently broadband. We can tune the waveguide geometry and cladding materials to unlock new spectral ranges: 

Visible Spectrum (400nm – 700nm): Optimized scattering profiles for atomic physics, quantum memories, and AR/VR applications. 

Mid-Infrared (2µm – 5µm): Leveraging the high transparency of Lithium Niobate/Tantalate for gas sensing, spectroscopy, and dual-comb sources. 

2. Custom Layer Stacks If the standard LN-CORE (400nm) or LT-PRO (300nm) film thicknesses do not fit your mode confinement needs, we can modify the starting material stack. 

Variable Film Thickness: From ultra-thin layers for evanescent field sensing to thick films (>600nm) for ultra-high power handling. 

Cladding Engineering: Custom oxide deposition or air-cladding options for precise dispersion engineering. 

3. Integration Readiness We don’t just build chips; we build platforms for systems. We can tailor the TFLX™ process flow to prepare your wafers for hybrid integration. 

Surface Preparation: Custom planarization and roughness control to facilitate direct wafer bonding. 

Bonding Interfaces: Deposition of specific Under-Bump Metallization (UBM) or alignment markers for flip-chip assembly. 

Cavity Etching: Deep trenching to create physical recesses for edge-coupled laser integration. 

 

Why Customize with Luxtelligence? 

Direct Access: No “black box” foundry rules. You talk directly to the experts defining the process. 

Physics-First: We understand that in quantum and ultrafast optics, every nanometer of geometry matters. 

Path to Scale: Even custom processes are designed with industrial viability in mind. Once your custom design is frozen, we can lock it in for volume production within the TFLX™ framework.