The TFLX™ platform was born from a collaboration between Prof. Tobias J. Kippenberg’s LPQM (EPFL) and Prof. Christian Koos’ IPQ (KIT). This partnership combined world-class microfabrication with high-speed optical communications expertise to lay the groundwork for our technology.
We spun off from EPFL to industrialize our proprietary Diamond-Like Carbon (DLC) etching technology, transitioning from academic research to a commercial entity dedicated to solving the bandwidth bottleneck.
Our technology was born in 2017 from PhD research and a doctoral thesis on integrating optoelectronic functions directly on silicon, proving the core principles of “optoelectronics on a chip.”
We released the world’s first open-access PDK for Thin-Film Lithium Niobate. Partnering with leading EDA vendors, we enabled designers to build on LN-CORE™ without needing deep knowledge of the underlying material physics. (Link to lnoi400)
We opened our dedicated testing lab in Switzerland featuring automated wafer-level probing. This facility allows us to characterize wafers up to 200mm and deliver verified Known-Good Dies (KGDs).
In collaboration with Keysight and Anritsu, we demonstrated high-speed data transmission at OFC San Francisco, proving the real-world readiness of our modulators for next-gen transceiver architectures.
We shipped the first commercial chips based on our LT-PRO™ platform. This marked the introduction of a new industrial standard featuring zero birefringence, high power handling and ultra-low bias drift.
We launched our volume manufacturing strategy, transferring our verified process to industrial 6-inch and 8-inch production lines to meet growing market demand.
Unlocking the full potential of Tantalate, we released the dedicated PDK for LT-PRO™. This enables engineers to design scalable, drift-free photonic circuits for mass-market applications. (Link to ltoi300)
